Xufulo Solutions
Chemical Resistance
Perfluorinated rubber (FFKM) components resist corrosion from more than 1,600 different chemicals, solvents and plasmas. Our products demonstrate superior performance in corrosive process environments. Whether faced with acidic, alkaline, amine, plasma or ultra-pure deionized water, manufacturers can effectively improve the sealing effect by selecting the most suitable parts for the specific application. We offer components in a wide range of compound formulations designed to optimize performance and ensure optimal performance across a wide range of chemicals and temperatures.
Minimal Swell
Chemically induced swelling can cause O-rings and sealing components made of other elastomers to extrude out of seal grooves, resulting in seal failures. Materials such as FFKM (fluorinated elastomers) have excellent chemical stability and high temperature resistance, and generally have a low coefficient of expansion. This allows FFKM to maintain its size and elasticity in high temperature and pressure environments, providing reliable sealing performance in demanding sealing applications. They have proven to be a cost-effective solution in situations where seals with maximum resistance to harsh chemical environments and high temperatures are required.
Heat Resistance
The excellent thermal stability and chemical resistance of perfluorinated elastomer components is attributed to the strong action of carbon-fluorine bonds in the perfluorinated chain. Even in long-term high-temperature environments of up to 325°C, our seals maintain greater elasticity and resilience than other elastomers. There is no plastic deformation, softening or hardening, which is often a key factor in seal performance degradation and eventual failure.
Low Compression Set
Our seals have a low compression deformation rate and can quickly return to their original thickness and shape when external pressure is removed. Our seals will not be permanently compressed or deformed even if they are under pressure for a long time in working condition, thus maintaining effective sealing performance.
Outgassing Performance
In wafer processing, sealing and degassing performance is very critical, because the presence or release of any gas can have a serious impact on the quality, accuracy and production efficiency of the wafer. Wafer processing is usually carried out in a highly clean and low-pollution environment, and the sealing material and degassing performance are directly related to the stability and yield of the process. Wafer processing equipment usually uses a variety of chemical gases and gas mixtures, the volatiles of these gases (such as residual gases, solvents, etc.) may have a negative impact on the processing environment, and even affect the final product quality. Therefore, the degassing property of the material is particularly important in this process.
Rapid Gas Decompression
The fast gas decompression performance of FFKM (fluorinated elastomer) seals is a key feature in high-speed gas decompression applications. FFKM is extremely resilient and resilient, which allows it to cope with the challenges of sudden pressure changes during rapid gas decompression. When gas is decompressed, seals need to quickly adapt to pressure changes and recover, and the elastic properties of FFKM ensure that they can maintain good sealing performance despite pressure fluctuations.
Adaptable to rapid gas decompression: FFKM’s elasticity allows seals to adapt to changes in pressure in a short period of time, especially when the pressure changes from high to low pressure, FFKM seals can be quickly restored to avoid gas leakage.
Adapt to rapid pressure changes: high-performance elastomers have excellent elasticity, can quickly recover deformation, adapt to instantaneous pressure changes in the process of gas decompression.
Good sealing performance: When the gas pressure drops rapidly, the elastomer seal can ensure that the gas does not leak, thus maintaining the stability of the system.
Minimize Wafer Contamination
Perfluorinated rubber (FFKM) is used as a seal on wafer processing equipment due to its superior resistance to chemicals, including reactive plasma and extreme temperatures up to 330°C. FFKM seals, through their excellent chemical resistance, low gas yield, low particle formation, high temperature stability and chemical reaction avoidance characteristics, can effectively reduce wafer pollution during the production process, ensure a clean environment in the semiconductor manufacturing process and guarantee the quality of the final product.
Weight Loss / Particle Generation
As a powerful etching, chemical vapor deposition (CVD) and stripping tool in semiconductor manufacturing, plasma is extremely consumable of materials. FFKM seals are widely used in these processes because of their excellent corrosion resistance. However, prolonged exposure to plasma can lead to seal surface degradation, which in turn increases the risk of particle contamination, affecting wafer yield and process reliability. Therefore, the ideal seal needs to maintain its sealing function while resisting surface degradation. FFKM seals are designed to resist chemical attack, extend seal life, reduce weight loss and particle generation, thereby increasing wafer yield, process reliability, and reducing equipment maintenance frequency.