Designed for the semiconductor industry and designed to provide an alternative material for mineral-filled perfluoroelastomers. Using co-agglomeration technology, organic particles were blended in situ with the substrate at a size as low as 40 nanometers. It meets the stringent requirements of plasma corrosion, gas corrosion, acid-base corrosion, high temperature corrosion, high cleanliness, etc., and has excellent resilience and outstanding compression permanent deformation properties.